2CRSi OCtoPUS Compute solutions

OCtoPus - Compute Solutions by 2CRSi 

Wouldn’t it be great if you could get the best compute power from your render farm whilst reducing your costs to update and maintain them?

While standard server architectures have reached their limits using traditional cooling, new technologies enable us to reach new levels of efficiency using the latest in Air Cooling, Direct Liquid Cooling, and full Immersion cooling technologies.

2CRSi’s unique range of OCtoPus server platforms and rack enclosures provide industry-leading compute density by taking advantage of industry-leading cooling technologies.

Their OCtoPus range is a new generation of servers based on the OCP (Open Compute Project) that provides a wide range of 21’’ servers optimised to take advantage of the latest in data center and HPC cooling technologies.

Opencompute

What is the OCP (Open Compute Project)?

The Open Compute Project (OCP) is an organization that shares designs of data center products and best practices among companies, including Facebook, IBM, Intel, Nokia, Google, Microsoft, Seagate Technology, Dell, Rackspace, Cisco, Goldman Sachs, Fidelity, Lenovo, Alibaba Group and many more industry giants.

As a platinum member of the OCP community, 2CRSi designs a wide range of OCP compliant solutions for servers, data storage, rack enclosures amongst other technologies needed for today's energy-efficient data centers.

OctoRange 32

OCtoPus servers by 2CRSi - A mix of insights & innovation

Octoover

All 2CRSi OCtoPus servers are designed, customized and produced in house to meet project requirements ensuring industry leading performance and design capabilities.

Designed for optimal heat dissipation, all OCtoPus server configurations can be adapted to our three cooling systems: 

Cooling Technologies Advantages
Air Cooling Using optimized air cooling their platforms can reduce power consumption by 23% compared to a 19'' solution
Direct Liquid Cooling Using liquid cooling on processor eliminates the need for coolers and decreases power consumption by up to 80% 
Immersion Cooling By fully immersing OCtoPus servers in a dielectric fluid, we can save up to 25% on CAPEX and 40% on OPEX costs

Octpus

OCtoPus server range

Type Model Capacity
OCtoPus Servers with multi graphic cards OCtoPus 1.2 One node and two GPUs
  OCtoPus 1.4 One node and four GPUs
  OCtoPus 1.8 One node and eight GPUs
OCtoPus Servers with dual-CPU with 2-slot GPU OCtoPus 2.2 Two nodes each with two GPUs
  OCtoPus 2.4 Two nodes each with one CPU and two GPUs
OCtoPus Servers with multiple single CPU nodes OCtoPus 3.0 Three nodes
  OCtoPus 3.0S Three nodes and multiple storage capacities
  OCtoPus 4.0 Four nodes
  OCtoPus 5.0 Five nodes
  OCtoPus 8.0 Eight nodes

OCtoPus 1.2 - One node and two GPUs 

octo12

   OCtoPus 1.2SP OCtoPus 1.2B OCtoPus 1.2E
Form Factor 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21"
Motherboard Intel® C621 Socket P Intel® C612 Socket R On Chip Socket SP3
Processors Up to 2x 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors Up to 2x Intel® Xeon® E5 v3/v4 Up to 2x AMD EPYC 700x
Memory Up to 24x DDR4 ECC RDIMM/LRDIMM (6-ch) Up to 24x DDR4 ECC RDIMM/LRDIMM (4-ch) Up to 8x DDR4 ECC RDIMM/LRDIMM (8-ch)
Network 2x 10GbE (RJ45) 2x 10GbE (SFP+) 2x 10GbE (SFP+)
PCIe Gen Gen 3.0 Gen 3.0 Gen 3.0
GPU 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, Or AMD Vega or Vega Pro cards 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, Or AMD Vega or Vega Pro cards 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, Or AMD Vega or Vega Pro cards
Storage Up to 2x M.2 NVMe Up to 2x M.2 NVMe Up to 2x M.2 NVMe
Port expansion 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP
Cooling Type Air cooling / Direct liquid cooling Air cooling / Immersion / Direct liquid cooling Air cooling / Immersion / Direct liquid cooling

OCtoPus 1.4 - One node and four GPUs

octo14

   OCtoPus 1.4SP OCtoPus 1.4B OCtoPus 1.4B
Form Factor 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21"
Motherboard Intel® C621 Socket P Intel® C612 Socket R On Chip Socket SP3
Processors 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors Intel® Xeon® E5 v3/v4 AMD EPYC 700x
Memory 24x DDR4 ECC RDIMM/LRDIMM (6-channel) 24x DDR4 ECC RDIMM/LRDIMM (4-channel) 8x DDR4 ECC RDIMM/LRDIMM (8-channel)
Network 2x 10GbE (RJ45) 2x 10GbE (SFP+) 2x 10GbE (SFP+)
PCIe Gen Gen 3.0 Gen 3.0 Gen 3.0
GPU 4x Dual-slot Nvidia® GeForce, Tesla, Quadro cards or AMD Vega or Vega Pro cards 4x Dual-slot Nvidia® GeForce, Tesla, Quadro cards or AMD Vega or Vega Pro cards 4x Dual-slot Nvidia® GeForce, Tesla, Quadro cards or AMD Vega or Vega Pro cards
Storage Up to 4x M.2 NVMe Up to 6x M.2 NVMe up to 4x M.2 NVMe
Port Expansion 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP
Cooling type Air cooling / Direct liquid cooling Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion

OCtoPus 1.8 - One node and eight GPUs

OctoRange 23

  OCtoPus 1.8SP OCtoPus 1.8B OCtoPus 1.8E
Form Factor 2 OpenU - 21" 2 OpenU - 21" 2 OpenU - 21"
Motherboard Intel® C621 Socket P Intel® C612 Socket R On-Chip Socket SP3
Processors 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors Intel® Xeon® E5 v3/v4 AMD EPYC 700x
Memory Up to 24x DDR4 ECC RDIMM/LRDIMM (6-ch) Up to 24x DDR4 ECC RDIMM/LRDIMM (4-ch) Up to 8x DDR4 ECC RDIMM/LRDIMM (8-ch)
Network 2x 10GbE (RJ45) 2x 10GbE (SFP+) 2x 10GbE (SFP+)
PCIe Gen Gen 3.0 Gen 3.0 Gen 3.0
GPU 8x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, orAMD Vega or Vega Pro cards 8x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, orAMD Vega or Vega Pro cards 8x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, orAMD Vega or Vega Pro cards
Storage 2x M.2 NVMe 2x M.2 NVMe 2x M.2 NVMe
Port Expansion 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP
Cooling type Air cooling / Direct liquid cooling Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion

OCtoPus 2.2 - Two nodes and two GPUs

OctoRange 24

   OCtoPus 2.2SP OCtoPus 2.2SB OCtoPus 2.2SX OCtoPus 2.2SE
Form Factor 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21"
Motherboard Intel® C621 Socket P Intel® C612 Socket R Intel® C612 Socket R4" On Chip Socket SP3
Processors 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors Intel® Xeon® E5 v3/v4 Intel® CoreTM X-Series AMD EPYC 700x
Memory 24x DDR4 ECC RDIMM/LRDIMM (6-ch) 24x DDR4 ECC RDIMM/LRDIMM (4-ch) 4x DDR4 (4-ch) 8x DDR4 ECC RDIMM/LRDIMM (8-ch)
Network 2x 10GbE (RJ45) 2x 10GbE (SFP+) 2x 1GbE (RJ45) 2x 10GbE (SFP+)
PCIe Gen Gen 3.0 Gen 3.0 Gen 3.0 Gen 3.0
GPU 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards
Storage Up to 2x M.2 NVMe Up to 2x M.2 NVMe Up to 2x M.2 NVMe Up to 2x M.2 NVMe
Port Expansion 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP
Cooling type Air cooling / Direct liquid cooling Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion

OCtoPus 2.4 - Two nodes and four GPUs

OctoRange 25

   OCtoPus 2.4SP OCtoPus 2.4E
Form Factor 1 OpenU - 21" 1 OpenU - 21"
Motherboard Intel® C621 Socket P On-Chip Socket SP3
Processors 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors AMD EPYC 700x
Memory 6x DDR4 ECC RDIMM/LRDIMM (6-ch) 8x DDR4 ECC RDIMM/LRDIMM (8-ch)
Network 2x 1GbE (RJ45)or 2x 10GbE (RJ45) From 1GbE to 100 GbE
PCIe Gen Gen 3.0 Gen 3.0
GPU 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, or AMD Vega or Vega Pro cards 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, or AMD Vega or Vega Pro cards
Storage 2x M.2 NVMe 2x M.2 NVMe
Port Expansion 1x PCIe 8x LP 1x PCIe 8x LP
Cooling type Air cooling / Direct liquid cooling Air cooling / Direct liquid cooling / Immersion

OCtoPus 3 - Three nodes

OctoRange 29

   OCtoPus 3B OCtoPus 3SP OCtoPus 3E
Form Factor 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21"
Motherboard Intel® C612 Socket R Intel® C612 Socket R N/A
Processors Intel® Xeon® E5 v3/v4 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors AMD EPYC 700x
Memory Up to 16x DDR4 ECC RDIMM/LRDIMM (4-ch) Up to 16x DDR4 ECC RDIMM/LRDIMM (6-ch) Up to 16x DDR4 ECC RDIMM (8-ch)
Network 2 x 1GbE (RJ45) Infiniband Fiber Channel From 1GbE to 100 GbE Infiniband Fiber Channel From 1GbE to 100 GbE Infiniband Fiber Channel
Storage 2x M.2 NVMe 1x SATADOM 2x M.2 NVMe 1x SATADOM 2x M.2 NVMe
Port Expansion 1x PCIe 16x1x PCIe 8x 2x PCIe 16x 2x PCIe x16 Gen4
Cooling type Air cooling / Immersion / Direct liquid cooling Air cooling / Direct liquid cooling Air cooling / Immersion / Direct liquid cooling

OCtoPus 4 - Four nodes

OctoRange 27

   OCtoPus 4B OCtoPus 4W OCtoPus 4X OCtoPus 4SP OCtoPus 4R
Form Factor 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21"
Motherboard Intel® C612 Socket R3 Intel® C612 Socket R4 Intel® C612 Socket R4 Intel® C622/621 Socket P AMD X470 Socket AM4
Processors Intel® Xeon® E5 v3/v4 Intel® Xeon® W-2xxx Intel® CoreTM X-Series 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors AMD Ryzen Series
Memory 4x DDR4 ECC RDIMM/LRDIMM (4-ch) 4x DDR4 ECC (4-ch) 4x DDR4 ECC (4-ch) 6x DDR4 ECC RDIMM/LRDIMM (6-ch) 4x slots Support DDR4 ECC/UDIMM 2-channel memory architecture
Network 2x 10GbE (RJ45) 2x 10GbE (RJ45) 2x 10GbE (RJ45) 2x 10GbE (RJ45/SFP+) or 2x 1GbE (RJ45) 2x 10GbE (RJ45) or 2x 1GbE (RJ45)
Storage 2x M.2 NVMe 2x M.2 NVMe 2x M.2 NVMe 2x M.2 NVMe 2x M.2 NVMe
Port Expansion 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP
Cooling type Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion

OCtoPus 5 - Five nodes

OctoRange 28

   OCtoPus 5SP OCtoPus 5B OCtoPus 5X OCtoPus 5W OCtoPus 5R
Form Factor 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21" 1 OpenU - 21"
Motherboard Intel® C622/621 Socket P Intel® C612 Socket R3 Intel® C612 Socket R4 Intel® C422 Socket R4 AMD X470 Socket AM4
Processors 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors Intel® Xeon® E5 v3/v4 Intel® CoreTM X-Series Intel® Xeon® W-2xxx AMD Ryzen Series
Memory 6x DDR4 ECC RDIMM/LRDIMM (6-ch) 4x DDR4 ECC RDIMM/LRDIMM (4-ch) 4x DDR4 (4-ch) 4x DDR4 ECC (4-ch) 4x slots Support DDR4 ECC/UDIMM2-channel memory architecture
Network 2x 10GbE (RJ45/SFP+) or 2x 1GbE (RJ45) 2x 10GbE (RJ45) 2x 1GbE (RJ45) 2x 1GbE (RJ45) 2x 10GbE (RJ45) or 2x 1GbE (RJ45)
Storage 2x M.2 NVMe 2x M.2 NVMe 2x M.2 NVMe 2x M.2 NVMe 2x M.2 NVMe
Port Expansion 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP 1x PCIe 8x LP
Cooling type Air cooling / Direct liquid cooling Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion Air cooling / Direct liquid cooling / Immersion

OCtoPus 8 - Eight nodes

OctoRange 26

   OCtoPus 8W
Form factor 1OpenU - 21"
Motherboard Intel® C422 Socket R4
Processors Intel® Xeon® W-2100 Processors
Memory 4x DDR4 ECC (4-ch)
Network 2x 1GbE (RJ45)
PCIe Gen 3.0
Storage 1x M.2 NVMe
Cooling Type Direct Liquid Cooling

21" Rack Benefits

 Maximized performance and density The density of the 21" server form factor allows you to increase the performance limits of traditional servers.
Easy maintenance
  • Power supply, fans, and servers are hot-pluggable.
  • Cables at the front.
  • LED indicators.
  • No tools required.
Increased reliability
  • Server downtime is Reduced.
  • Fans and power supplies are grouped together.
  • Redundancy of power supplies.
Maximized performance and density By reducing power consumption, the OCtoPus reduces CO2 emissions in Datacenters

Air Cooling - Pushing air-cooling efficiency to its limits

Aircooling

The OCtoPus was created in 2017 while we were trying to improve the efficiency of a standard OCP cluster. In addition to all the developments around the servers, we rethought the implementation of fans and power supply at the rack level.

We chose to aggregate all the fans at the rear of the rack, to add smart control of the fans speed and to monitor the power distribution. These developments made it possible to reduce power consumption by 23%.

By mutualizing fans at the back of the rack, we were able to reduce power consumption and include a control manager that adapts the fan speed to the temperature of the servers.

Optimized air cooling increases the air flow and heat dissipation inside the servers, so space is optimized for component management. The failure rate and intervention time are reduced thanks to the centralized power supply of the servers by busbars and shared ventilation.

Directliquid

Direct Liquid Cooling - A combination between direct liquid and air cooling

Air cooling is not efficient enough to support ultra-high density. With this in mind, we adapted direct liquid cooling to our air-cooling rack: specific higher power server components such as CPUs and GPUs are exposed to liquid in order to be cooled more efficiently than air cooling. The highest performance servers can be integrated efficiently using this approach.

Our DLC rack includes manifolds with double shut-off valves to ensure hot-swappable liquid distribution to the servers at the rear of the rack. In addition to the DLC, 9 fans ensure to keep the remaining components cool to avoid SPOFs (Single Point Of Failure).

In order to meet the growing need for very high performance and high-density servers, we have designed the hybrid racks with direct liquid cooling of processors and GPUs.

The most power-hungry and particularly heated components are exposed to a liquid circuit in order to be cooled more efficiently than by air cooling.

Immersion Cooling

Immersion Cooling - Get to the highest level of cooling

To go further in energy saving and performance, 2CRSI develops solutions with immersion cooling. Servers are submerged in tanks filled with a non- conductive fluid which cools all the components down, allowing to reach the highest level of data center efficiency.

Thanks to immersion, servers do not need fans to be cooled anymore and data centers no longer need to invest in expensive and inefficient air con- ditioning systems. At the scale of a datacenter, this represents 25% savings on the implemen- tation of a datacenter (CAPEX) and 40% on its operating costs (OPEX).

Immersion cooling is a sustainable choice: life of the components is extended, energy consumption is reduced and the heat generated can be reused.

To push back the limits of energy saving and performance, 2CRSI develops immersion cooling solutions. Servers are immersed in tanks filled with a non-conductive fluid that cools all components. This technology allows a data center to achieve the best possible energy performance by reducing the floor space used.

As an indication, the surface area required for a set of 200 racks in air cooling is approximately 1000m2. At equivalent power, with immersion cooling, the requirement is only 20 racks, which represents a total surface area of 30m2.

Space saving between 85 and 97%. Average PUE of 1.03.

Immersion

Who are 2CRSi?

Founded in Strasbourg (France), the 2CRSi group develops, produces, and sells ultra-high-performance customised environmentally-friendly servers. In 2018, 2CRSi generated a turnover multiplied by 2.1 to 65 M €. With the integration of Boston Limited acquired in November 2019, the Group has 320 employees and the offer of innovative solutions (processing, storage, and networking) is now distributed in more than 45 countries. 2CRSi has been listed since June 2018 on the regulated market of Euronext in Paris (ISIN Code: FR0013341781).

2CRSi - 2020 Corporate presentation

Intel and 2CRSi at SC19

OCP Interviews Adrian Badina

What is the OCP (Open Compute Project) and who is it for?

The Open Compute Project (OCP) is an organization that shares designs of data center products and best practices among companies, including Facebook, IBM, Intel, Nokia, Google, Microsoft, Seagate Technology, Dell, Rackspace, Cisco, Goldman Sachs, Fidelity, Lenovo, Alibaba Group and many more industry giants.

As a platinum member of the OCP community, 2CRSi designs a wide range of OCP compliant solutions for servers, data storage, rack enclosures amongst other technologies needed for today's energy-efficient data centers.

Further information: https://www.opencompute.org/wiki/Main_Page