OCtoPus - Compute Solutions by 2CRSi
Wouldn’t it be great if you could get the best compute power from your render farm whilst reducing your costs to update and maintain them?
While standard server architectures have reached their limits using traditional cooling, new technologies enable us to reach new levels of efficiency using the latest in Air Cooling, Direct Liquid Cooling, and full Immersion cooling technologies.
2CRSi’s unique range of OCtoPus server platforms and rack enclosures provide industry-leading compute density by taking advantage of industry-leading cooling technologies.
Their OCtoPus range is a new generation of servers based on the OCP (Open Compute Project) that provides a wide range of 21’’ servers optimised to take advantage of the latest in data center and HPC cooling technologies.
The Open Compute Project (OCP) is an organization that shares designs of data center products and best practices among companies, including Facebook, IBM, Intel, Nokia, Google, Microsoft, Seagate Technology, Dell, Rackspace, Cisco, Goldman Sachs, Fidelity, Lenovo, Alibaba Group and many more industry giants.
As a platinum member of the OCP community, 2CRSi designs a wide range of OCP compliant solutions for servers, data storage, rack enclosures amongst other technologies needed for today's energy-efficient data centers.
All 2CRSi OCtoPus servers are designed, customized and produced in house to meet project requirements ensuring industry leading performance and design capabilities.
Designed for optimal heat dissipation, all OCtoPus server configurations can be adapted to our three cooling systems:
Cooling Technologies | Advantages |
Air Cooling | Using optimized air cooling their platforms can reduce power consumption by 23% compared to a 19'' solution |
Direct Liquid Cooling | Using liquid cooling on processor eliminates the need for coolers and decreases power consumption by up to 80% |
Immersion Cooling | By fully immersing OCtoPus servers in a dielectric fluid, we can save up to 25% on CAPEX and 40% on OPEX costs |
Type | Model | Capacity |
OCtoPus Servers with multi graphic cards | OCtoPus 1.2 | One node and two GPUs |
OCtoPus 1.4 | One node and four GPUs | |
OCtoPus 1.8 | One node and eight GPUs | |
OCtoPus Servers with dual-CPU with 2-slot GPU | OCtoPus 2.2 | Two nodes each with two GPUs |
OCtoPus 2.4 | Two nodes each with one CPU and two GPUs | |
OCtoPus Servers with multiple single CPU nodes | OCtoPus 3.0 | Three nodes |
OCtoPus 3.0S | Three nodes and multiple storage capacities | |
OCtoPus 4.0 | Four nodes | |
OCtoPus 5.0 | Five nodes | |
OCtoPus 8.0 | Eight nodes |
OCtoPus 1.2SP | OCtoPus 1.2B | OCtoPus 1.2E | |
Form Factor | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" |
Motherboard | Intel® C621 Socket P | Intel® C612 Socket R | On Chip Socket SP3 |
Processors | Up to 2x 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | Up to 2x Intel® Xeon® E5 v3/v4 | Up to 2x AMD EPYC 700x |
Memory | Up to 24x DDR4 ECC RDIMM/LRDIMM (6-ch) | Up to 24x DDR4 ECC RDIMM/LRDIMM (4-ch) | Up to 8x DDR4 ECC RDIMM/LRDIMM (8-ch) |
Network | 2x 10GbE (RJ45) | 2x 10GbE (SFP+) | 2x 10GbE (SFP+) |
PCIe Gen | Gen 3.0 | Gen 3.0 | Gen 3.0 |
GPU | 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, Or AMD Vega or Vega Pro cards | 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, Or AMD Vega or Vega Pro cards | 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, Or AMD Vega or Vega Pro cards |
Storage | Up to 2x M.2 NVMe | Up to 2x M.2 NVMe | Up to 2x M.2 NVMe |
Port expansion | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP |
Cooling Type | Air cooling / Direct liquid cooling | Air cooling / Immersion / Direct liquid cooling | Air cooling / Immersion / Direct liquid cooling |
OCtoPus 1.4SP | OCtoPus 1.4B | OCtoPus 1.4B | |
Form Factor | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" |
Motherboard | Intel® C621 Socket P | Intel® C612 Socket R | On Chip Socket SP3 |
Processors | 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | Intel® Xeon® E5 v3/v4 | AMD EPYC 700x |
Memory | 24x DDR4 ECC RDIMM/LRDIMM (6-channel) | 24x DDR4 ECC RDIMM/LRDIMM (4-channel) | 8x DDR4 ECC RDIMM/LRDIMM (8-channel) |
Network | 2x 10GbE (RJ45) | 2x 10GbE (SFP+) | 2x 10GbE (SFP+) |
PCIe Gen | Gen 3.0 | Gen 3.0 | Gen 3.0 |
GPU | 4x Dual-slot Nvidia® GeForce, Tesla, Quadro cards or AMD Vega or Vega Pro cards | 4x Dual-slot Nvidia® GeForce, Tesla, Quadro cards or AMD Vega or Vega Pro cards | 4x Dual-slot Nvidia® GeForce, Tesla, Quadro cards or AMD Vega or Vega Pro cards |
Storage | Up to 4x M.2 NVMe | Up to 6x M.2 NVMe | up to 4x M.2 NVMe |
Port Expansion | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP |
Cooling type | Air cooling / Direct liquid cooling | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion |
OCtoPus 1.8SP | OCtoPus 1.8B | OCtoPus 1.8E | |
Form Factor | 2 OpenU - 21" | 2 OpenU - 21" | 2 OpenU - 21" |
Motherboard | Intel® C621 Socket P | Intel® C612 Socket R | On-Chip Socket SP3 |
Processors | 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | Intel® Xeon® E5 v3/v4 | AMD EPYC 700x |
Memory | Up to 24x DDR4 ECC RDIMM/LRDIMM (6-ch) | Up to 24x DDR4 ECC RDIMM/LRDIMM (4-ch) | Up to 8x DDR4 ECC RDIMM/LRDIMM (8-ch) |
Network | 2x 10GbE (RJ45) | 2x 10GbE (SFP+) | 2x 10GbE (SFP+) |
PCIe Gen | Gen 3.0 | Gen 3.0 | Gen 3.0 |
GPU | 8x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, orAMD Vega or Vega Pro cards | 8x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, orAMD Vega or Vega Pro cards | 8x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, orAMD Vega or Vega Pro cards |
Storage | 2x M.2 NVMe | 2x M.2 NVMe | 2x M.2 NVMe |
Port Expansion | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP |
Cooling type | Air cooling / Direct liquid cooling | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion |
OCtoPus 2.2SP | OCtoPus 2.2SB | OCtoPus 2.2SX | OCtoPus 2.2SE | |
Form Factor | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" |
Motherboard | Intel® C621 Socket P | Intel® C612 Socket R | Intel® C612 Socket R4" | On Chip Socket SP3 |
Processors | 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | Intel® Xeon® E5 v3/v4 | Intel® CoreTM X-Series | AMD EPYC 700x |
Memory | 24x DDR4 ECC RDIMM/LRDIMM (6-ch) | 24x DDR4 ECC RDIMM/LRDIMM (4-ch) | 4x DDR4 (4-ch) | 8x DDR4 ECC RDIMM/LRDIMM (8-ch) |
Network | 2x 10GbE (RJ45) | 2x 10GbE (SFP+) | 2x 1GbE (RJ45) | 2x 10GbE (SFP+) |
PCIe Gen | Gen 3.0 | Gen 3.0 | Gen 3.0 | Gen 3.0 |
GPU | 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards | 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards | 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards | 1X Dual-slot Nvidia® GeForce, Tesla, Quadro cards,orAMD Vega or Vega Pro cards |
Storage | Up to 2x M.2 NVMe | Up to 2x M.2 NVMe | Up to 2x M.2 NVMe | Up to 2x M.2 NVMe |
Port Expansion | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP |
Cooling type | Air cooling / Direct liquid cooling | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion |
OCtoPus 2.4SP | OCtoPus 2.4E | |
Form Factor | 1 OpenU - 21" | 1 OpenU - 21" |
Motherboard | Intel® C621 Socket P | On-Chip Socket SP3 |
Processors | 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | AMD EPYC 700x |
Memory | 6x DDR4 ECC RDIMM/LRDIMM (6-ch) | 8x DDR4 ECC RDIMM/LRDIMM (8-ch) |
Network | 2x 1GbE (RJ45)or 2x 10GbE (RJ45) | From 1GbE to 100 GbE |
PCIe Gen | Gen 3.0 | Gen 3.0 |
GPU | 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, or AMD Vega or Vega Pro cards | 2x Dual-slot Nvidia® GeForce, Tesla, Quadro cards, or AMD Vega or Vega Pro cards |
Storage | 2x M.2 NVMe | 2x M.2 NVMe |
Port Expansion | 1x PCIe 8x LP | 1x PCIe 8x LP |
Cooling type | Air cooling / Direct liquid cooling | Air cooling / Direct liquid cooling / Immersion |
OCtoPus 3B | OCtoPus 3SP | OCtoPus 3E | |
Form Factor | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" |
Motherboard | Intel® C612 Socket R | Intel® C612 Socket R | N/A |
Processors | Intel® Xeon® E5 v3/v4 | 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | AMD EPYC 700x |
Memory | Up to 16x DDR4 ECC RDIMM/LRDIMM (4-ch) | Up to 16x DDR4 ECC RDIMM/LRDIMM (6-ch) | Up to 16x DDR4 ECC RDIMM (8-ch) |
Network | 2 x 1GbE (RJ45) Infiniband Fiber Channel | From 1GbE to 100 GbE Infiniband Fiber Channel | From 1GbE to 100 GbE Infiniband Fiber Channel |
Storage | 2x M.2 NVMe | 1x SATADOM 2x M.2 NVMe | 1x SATADOM 2x M.2 NVMe |
Port Expansion | 1x PCIe 16x1x PCIe 8x | 2x PCIe 16x | 2x PCIe x16 Gen4 |
Cooling type | Air cooling / Immersion / Direct liquid cooling | Air cooling / Direct liquid cooling | Air cooling / Immersion / Direct liquid cooling |
OCtoPus 4B | OCtoPus 4W | OCtoPus 4X | OCtoPus 4SP | OCtoPus 4R | |
Form Factor | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" |
Motherboard | Intel® C612 Socket R3 | Intel® C612 Socket R4 | Intel® C612 Socket R4 | Intel® C622/621 Socket P | AMD X470 Socket AM4 |
Processors | Intel® Xeon® E5 v3/v4 | Intel® Xeon® W-2xxx | Intel® CoreTM X-Series | 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | AMD Ryzen Series |
Memory | 4x DDR4 ECC RDIMM/LRDIMM (4-ch) | 4x DDR4 ECC (4-ch) | 4x DDR4 ECC (4-ch) | 6x DDR4 ECC RDIMM/LRDIMM (6-ch) | 4x slots Support DDR4 ECC/UDIMM 2-channel memory architecture |
Network | 2x 10GbE (RJ45) | 2x 10GbE (RJ45) | 2x 10GbE (RJ45) | 2x 10GbE (RJ45/SFP+) or 2x 1GbE (RJ45) | 2x 10GbE (RJ45) or 2x 1GbE (RJ45) |
Storage | 2x M.2 NVMe | 2x M.2 NVMe | 2x M.2 NVMe | 2x M.2 NVMe | 2x M.2 NVMe |
Port Expansion | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP |
Cooling type | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion |
OCtoPus 5SP | OCtoPus 5B | OCtoPus 5X | OCtoPus 5W | OCtoPus 5R | |
Form Factor | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" | 1 OpenU - 21" |
Motherboard | Intel® C622/621 Socket P | Intel® C612 Socket R3 | Intel® C612 Socket R4 | Intel® C422 Socket R4 | AMD X470 Socket AM4 |
Processors | 2nd Generation Intel® Xeon® Cascade Lake and Intel® Xeon® Scalable Processors | Intel® Xeon® E5 v3/v4 | Intel® CoreTM X-Series | Intel® Xeon® W-2xxx | AMD Ryzen Series |
Memory | 6x DDR4 ECC RDIMM/LRDIMM (6-ch) | 4x DDR4 ECC RDIMM/LRDIMM (4-ch) | 4x DDR4 (4-ch) | 4x DDR4 ECC (4-ch) | 4x slots Support DDR4 ECC/UDIMM2-channel memory architecture |
Network | 2x 10GbE (RJ45/SFP+) or 2x 1GbE (RJ45) | 2x 10GbE (RJ45) | 2x 1GbE (RJ45) | 2x 1GbE (RJ45) | 2x 10GbE (RJ45) or 2x 1GbE (RJ45) |
Storage | 2x M.2 NVMe | 2x M.2 NVMe | 2x M.2 NVMe | 2x M.2 NVMe | 2x M.2 NVMe |
Port Expansion | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP | 1x PCIe 8x LP |
Cooling type | Air cooling / Direct liquid cooling | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion | Air cooling / Direct liquid cooling / Immersion |
OCtoPus 8W | |
Form factor | 1OpenU - 21" |
Motherboard | Intel® C422 Socket R4 |
Processors | Intel® Xeon® W-2100 Processors |
Memory | 4x DDR4 ECC (4-ch) |
Network | 2x 1GbE (RJ45) |
PCIe | Gen 3.0 |
Storage | 1x M.2 NVMe |
Cooling Type | Direct Liquid Cooling |
Maximized performance and density | The density of the 21" server form factor allows you to increase the performance limits of traditional servers. |
Easy maintenance |
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Increased reliability |
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Maximized performance and density | By reducing power consumption, the OCtoPus reduces CO2 emissions in Datacenters |
The OCtoPus was created in 2017 while we were trying to improve the efficiency of a standard OCP cluster. In addition to all the developments around the servers, we rethought the implementation of fans and power supply at the rack level.
We chose to aggregate all the fans at the rear of the rack, to add smart control of the fans speed and to monitor the power distribution. These developments made it possible to reduce power consumption by 23%.
By mutualizing fans at the back of the rack, we were able to reduce power consumption and include a control manager that adapts the fan speed to the temperature of the servers.
Optimized air cooling increases the air flow and heat dissipation inside the servers, so space is optimized for component management. The failure rate and intervention time are reduced thanks to the centralized power supply of the servers by busbars and shared ventilation.
Air cooling is not efficient enough to support ultra-high density. With this in mind, we adapted direct liquid cooling to our air-cooling rack: specific higher power server components such as CPUs and GPUs are exposed to liquid in order to be cooled more efficiently than air cooling. The highest performance servers can be integrated efficiently using this approach.
Our DLC rack includes manifolds with double shut-off valves to ensure hot-swappable liquid distribution to the servers at the rear of the rack. In addition to the DLC, 9 fans ensure to keep the remaining components cool to avoid SPOFs (Single Point Of Failure).
In order to meet the growing need for very high performance and high-density servers, we have designed the hybrid racks with direct liquid cooling of processors and GPUs.
The most power-hungry and particularly heated components are exposed to a liquid circuit in order to be cooled more efficiently than by air cooling.
To go further in energy saving and performance, 2CRSI develops solutions with immersion cooling. Servers are submerged in tanks filled with a non- conductive fluid which cools all the components down, allowing to reach the highest level of data center efficiency.
Thanks to immersion, servers do not need fans to be cooled anymore and data centers no longer need to invest in expensive and inefficient air con- ditioning systems. At the scale of a datacenter, this represents 25% savings on the implemen- tation of a datacenter (CAPEX) and 40% on its operating costs (OPEX).
Immersion cooling is a sustainable choice: life of the components is extended, energy consumption is reduced and the heat generated can be reused.
To push back the limits of energy saving and performance, 2CRSI develops immersion cooling solutions. Servers are immersed in tanks filled with a non-conductive fluid that cools all components. This technology allows a data center to achieve the best possible energy performance by reducing the floor space used.
As an indication, the surface area required for a set of 200 racks in air cooling is approximately 1000m2. At equivalent power, with immersion cooling, the requirement is only 20 racks, which represents a total surface area of 30m2.
Space saving between 85 and 97%. Average PUE of 1.03.
Founded in Strasbourg (France), the 2CRSi group develops, produces, and sells ultra-high-performance customised environmentally-friendly servers. In 2018, 2CRSi generated a turnover multiplied by 2.1 to 65 M €. With the integration of Boston Limited acquired in November 2019, the Group has 320 employees and the offer of innovative solutions (processing, storage, and networking) is now distributed in more than 45 countries. 2CRSi has been listed since June 2018 on the regulated market of Euronext in Paris (ISIN Code: FR0013341781).
The Open Compute Project (OCP) is an organization that shares designs of data center products and best practices among companies, including Facebook, IBM, Intel, Nokia, Google, Microsoft, Seagate Technology, Dell, Rackspace, Cisco, Goldman Sachs, Fidelity, Lenovo, Alibaba Group and many more industry giants.
As a platinum member of the OCP community, 2CRSi designs a wide range of OCP compliant solutions for servers, data storage, rack enclosures amongst other technologies needed for today's energy-efficient data centers.
Further information: https://www.opencompute.org/wiki/Main_Page